JEDEC 2018 PIND Testing of UB Devices
SUMMARYMIL-STD-750 TM2052 PIND TESTING “UB” PACKAGED DEVICES Click here for full PowerPoint: JEDEC 2018 PIND Testing of UB Devices Power Point INTRODUCTION: The “UB” packages are one of the smallest devices ever subjected to the PIND test. These devices measure just 0.12″L x 0.10″W x 0.05″H with an internal cavity of about 0.015″ resulting in … Read more